Overview

• Power Module Material： Ceramic+FR4+Copper base Layer Coverage：4 Layers+Copper base Surface Technique： Immersion Gold Specialty：Ceramic+FR4 Multiply materials copper-clad laminate.
• O-E Module Material： Ceramic+FR4 Layer Coverage：6 Layers Thickness：1.0 mm Surface Technique：Gold-plate +finger Specialty：Embedded Orientation.
• Embedded Systems Material： FR4 Layer Coverage：8 Layers Thickness：1.6 mm Surface Technique：HAL Line Width/Space：4mils/4mils Solder Mask Colour：Yellow.
• DC/DC Power Module Material： Hi-Tg (170℃)、FR4 Layer Coverage：10 Layers Thickness：1.6 mm Surface Technique：Immersion Gold Specialty：Copper Weight 105 um Blind-via/Buried-via Larger Current.
• Telecommunication base-station Material： FR4 Layer Coverage：8 Layers Thickness：2.0 mm Surface Technique：HAL Line Width/Space：4mils/4mils Specialty：BGA、Impedance Control、Shade Solder.
• Data Collect Material： FR4 Layer Coverage：6 Layers Thickness：1.6 mm Surface：Electrolytic Au + Finger Au Weight Of Finger：30 Microinch Solder Mask Colour：blueBlind-via